WILL WILL WAY LTD.

RE-Strengthened Mg Alloy for Die Casting Processes: LX2701

Light weight and ultra-thin are ongoing trend of designs for laptops, phones, tablets, AR glasses and more mobile 3C products. This is the reason for selecting Magnesium (Mg) to be the mainstream materials of outer cases or internal structures. Lots of Mg-alloy products have been formed by processes of die casting, thixomolding and semisolid die-casting. 

AZ91D Mg alloy has been widely used as the material for producing 3C products for years, however, its fluidity and mechanical properties are not enough for ultra-thin products. Requirement of heat dissipation improvement has been emerging with rapidly upgrading performances of 3C products, but thermal conductivity is also the problem of AZ91D.

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Through our experience of material technology and Mg processing technique, we launch a rare-earth-strengthened Mg alloy "LX2701," which features stronger mechanical properties and thermal conductivity than AZ91D. By selecting LX2701 as material, designers could get their products thinner and still strong to increase user experiences.